Capabilities
Published numbers. Audited process.
Every line below is our certified, day-to-day capability — audited by third parties, not best-case marketing. Download the full capability PDF or jump straight to the spec tables.
- Max layers
- 40
- Min trace
- 2 mil
- Impedance
- ±5%
- IPC default
- Class 3
At a Glance
Six capabilities, each audited
PCB Fabrication
Certified fab capability
In-house drilling, plating, LDI imaging, AOI and flying-probe testing — published ranges below are day-to-day production capability, not lab best case.
| Stack-up | |
| Layer count | 1 – 40 layers |
|---|---|
| Max panel size | 520 × 620 mm |
| Board thickness | 0.2 – 7.0 mm |
| Aspect ratio | 10:1 (through-hole) |
| Traces & Vias | |
| Min trace / space 0.05 / 0.05 mm | 2 mil / 2 mil |
| Min mechanical drill | 0.15 mm |
| Min laser microvia | 0.075 mm |
| Blind / buried vias | Yes — any-layer HDI |
| Copper & Finish | |
| Copper weight | 0.5 – 12 oz |
| Surface finish | HASL · Lead-free HASL · ENIG · ENEPIG · Hard Gold · OSP |
| Solder mask | Green / Black / White / Red / Blue / Yellow / Matte |
| Tolerances | |
| Impedance control | ±5% (50Ω / 90Ω / 100Ω) |
| Dimensional tolerance | ±0.1 mm (laser) |
PCB Assembly
Certified SMT / THT capability
Eight SMT lines running Fuji NXT-III and ASM SIPLACE heads — 0.3mm BGA pitch down to 01005 passives — inspected 100% inline via 3D SPI, AOI and X-ray.
| Components | |
| Smallest passive | 01005 (0402 metric) |
|---|---|
| BGA pitch (min) | 0.3 mm |
| Component types | QFN · BGA · µBGA · PoP · CSP · LGA · DFN |
| Board handling | |
| Board size | 5 × 5 mm – 510 × 460 mm |
| Thickness | 0.4 – 6.0 mm |
| Inspection | |
| AOI | 100% inline 3D |
| X-ray | 100% on BGA / QFN / hidden joints |
| SPI | 3D solder paste inspection on every panel |
| Test options | |
| ICT / Flying probe | Available |
| Functional test (FCT) | Per customer spec |
| Reliability | HALT · Thermal cycle · HAST · Vibration |
Certifications
Certified & audited continuously
Frequently Asked Questions
Capability questions
01Are these numbers audited or self-reported?
Audited. Our IATF 16949 and ISO 13485 certifications are reassessed annually by SGS / TÜV. The PCB capability range is validated on every lot via AOI, SPI and first-article inspection.
02Can you exceed the published max (e.g., beyond 40 layers)?
Occasionally, on a case-by-case basis. If your design needs 48 or 52 layers, contact us — we partner with a specialist fab for runs beyond our in-house range but keep full quality oversight.
03Do you provide impedance reports?
Yes — every impedance-controlled order ships with a Polar Si9000 stack-up PDF plus coupon test results per panel.
04What reliability testing do you offer in-house?
Thermal cycle (–55°C to +125°C), HAST, HALT, mechanical vibration, drop test, and solderability testing. Full IPC-TM-650 test methods. Third-party labs used for certifications we don’t hold.
Ready when you are
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