Rigid-Flex PCB Manufacturing
6–20 layer Rigid-Flex, built to fold.
Hybrid PCBs that combine rigid FR-4 zones with polyimide flex cores — so you can route around corners, eliminate connectors and drop weight. IPC-6013 Class 3 default, no MOQ, 5–10 day lead time.
- Layers
- 6–20
- Impedance
- ±5%
- Default class
- IPC 3
- Flex cycles
- 100k
Why Rigid-Flex
One board, three dimensions
Rigid-Flex replaces the cable-harness-connector sandwich with a single folded assembly. You get better signal integrity, fewer solder joints, 30–40% weight savings, and significantly higher vibration resilience.
- Eliminates connectors → fewer failure points
- Dynamic bend rated for 100,000+ flex cycles
- Polyimide core handles –65°C to +200°C
- Drops assembly cost for complex enclosures
Technical Specification
Rigid-Flex capability range
Every value below is our certified range, not a best case. DFM will advise where your design sits on the yield curve.
| Stack-up | |
| Total layer count | 2 – 20 layers |
|---|---|
| Rigid layers | 2 – 16 |
| Flex layers | 1 – 6 |
| Board thickness (rigid) | 0.4 – 3.2 mm |
| Board thickness (flex) | 0.08 – 0.5 mm |
| Materials | |
| Flex core | DuPont Pyralux AP / LF, Shengyi SF305 |
| Rigid core | FR-4 (TG 150 / 170), high-Tg on request |
| Adhesive | Acrylic / epoxy / no-flow prepreg |
| Coverlay | Polyimide 12.5 / 25 / 50 µm |
| Traces & vias | |
| Min trace / space (rigid) | 3 mil / 3 mil |
|---|---|
| Min trace / space (flex) | 4 mil / 4 mil |
| Min mechanical drill | 0.15 mm |
| Min laser microvia | 0.075 mm |
| Blind / buried vias | Yes |
| Copper | |
| Rigid copper weight | 0.5 oz – 4 oz |
| Flex copper weight | 0.5 oz – 2 oz (rolled annealed) |
| Tolerances | |
| Impedance control 50Ω / 90Ω / 100Ω | ±5% |
| Dynamic bend cycles 180° at 6× thickness | 100,000+ |
| Operating temperature | –65°C to +200°C |
| Compliance | IPC-6013 Class 3 · UL 94 V-0 |
Manufacturing Process
From DFM to E-test in 6 controlled steps
Every step below happens under one roof in our Shenzhen HQ — no subcontracting, no lost panels in transit, full lot traceability from raw laminate to finished assembly.
- 01
DFM review
Senior engineer audits stack-up, bend radius, impedance.
- 02
Material kitting
Polyimide + FR-4 laminates bonded with acrylic or epoxy adhesive.
- 03
Imaging & etching
LDI imaging of inner / flex layers with no bend-fatigue defects.
- 04
Lamination
Vacuum press bonding rigid sections to flex core without delamination.
- 05
Drill & plate
Controlled-depth drill + copper plate for blind / buried vias.
- 06
QA & 100% E-test
AOI, flying-probe, X-ray + IPC-6013 Class 3 inspection.
Where It Ships
Applications we build for
Frequently Asked Questions
Rigid-Flex FAQ
01How do I define the bend zones in my Gerber?
Include a mechanical layer that outlines every flex region and mark the bend axis with a centerline. Also specify the minimum bend radius (typically 6× flex thickness for static, 10× for dynamic). Our DFM team will audit this on the free quote review.
02Can I mix different copper weights in the rigid and flex zones?
Yes. Typical builds run 1 oz in rigid regions and 0.5 oz rolled-annealed in flex regions. Higher copper on flex (2 oz) is possible but increases bend radius and may reduce cycle life.
03What is the typical lead time for a prototype?
5–10 business days for 6–10 layer rigid-flex prototypes, 10–15 days for 12+ layers with blind/buried vias. Express 72-hour quick-turn available on simple 4-layer builds.
04Do you provide a Polar stack-up before we commit?
Yes — we send a Polar Si9000 impedance-controlled stack-up PDF with every rigid-flex quote. It accounts for coverlay thickness and dielectric constant of the specific Pyralux grade you choose.
05What test coverage ships with each order?
100% flying-probe electrical test, AOI on inner and outer layers, X-ray for blind/buried vias, coverlay peel test coupon, and an IPC-6013 Class 3 first-article inspection report per build panel.
Ready when you are
Send your Gerber & BOM — get a quote in 24 hours.
NDA available · Free DFM review · Senior engineer response.