HDI PCB Manufacturing
Any-layer HDI up to 40 layers.
Stacked & staggered microvias, laser-drilled down to 75 µm, supporting 0.3 mm BGA pitch. Built for 5G RF, ADAS modules, and miniaturized consumer electronics.
- Max layers
- 40
- Laser microvia
- 75µm
- BGA pitch
- 0.3mm
- Min trace
- 2 mil
HDI Via Architectures
Four via strategies, one fab
Choose the via stack that fits your layer count, signal integrity budget and cost target. We’ll help you pick during DFM review.
HDI Capability
Certified HDI fabrication range
| Stack-up | |
| Max layer count | 40 layers (any-layer HDI) |
|---|---|
| Via architecture | Type I / II / III / Any-layer |
| Stacked microvia levels | Up to 6 stacked |
| Traces & Vias | |
| Min trace / space | 2 mil / 2 mil |
| Min laser microvia | 0.075 mm (75 µm) |
| Min mechanical drill | 0.15 mm |
| BGA pitch | 0.3 mm (12 mil) |
| Copper & Finish | |
| Copper weight | 0.5 – 3 oz |
| Surface finish | ENIG · ENEPIG · Hard Gold · OSP |
| Tolerances | |
| Impedance control | ±5% |
| Compliance | IPC-6012 Class 3 · IPC-6018 for RF |
Where HDI Ships
Applications
Frequently Asked Questions
HDI PCB FAQ
01When should I choose HDI over standard multi-layer?
When your BGA pitch is ≤ 0.5 mm and the pin count is high (400+), standard through-hole via routing fails. HDI microvias solve the fan-out density problem.
02What is "any-layer HDI"?
Any-layer HDI means every layer transition uses microvias — no through-hole vias at all. Maximum routing density, best signal integrity for fine-pitch BGAs, but highest cost.
03Do you support stacked microvias?
Yes — up to 6 stacked levels with copper-filled plating. We follow IPC-6012 Class 3 acceptance criteria on every panel.
04What is the typical lead time?
6–10 layer HDI: 7–10 business days. 12–16 layers with stacked microvias: 10–15 days. 18+ layer any-layer: 15–20 days. Quick-turn prototypes available on select stack-ups.
Ready when you are
Send your Gerber & BOM — get a quote in 24 hours.
NDA available · Free DFM review · Senior engineer response.